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蔡维伽

Max Cai

SUSS MicroTec (Shanghai) Co., Ltd.

Specialist Bonder Equipment



蔡维伽先生目前就任SUSS MicroTec公司的键合技术专家一职。自从2006年加入SUSS以来,他便一直专注于晶圆键合工艺。十多年来,他和SUSS全球晶圆键合专家团队,与国内多家半导体工厂、研究所及大学共同工作,帮助客户研究,发展及完善晶圆键合工艺在半导体制造多个领域的应用。


Max.Cai is bonder equipment specialist ofSUSS MircoTec. He joined SUSS on 2006, and since then focused on wafer bonding technology. He worked with SUSS global wafer bonding specialist team to support semiconductor foundries, institutes and universities in China, helpedcustomers to settle and develop their wafer bonding technology in various of different applications for decade.

 


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